What’s Bare Die?

Most electronic components begin with the manufacture of “wafers”. These wafers are then sawn into “die”. The die are then put into packages that the majority of customers can place them on printed circuit boards, or (PCB).  Hybrid manufacturers will purchase the “die” level product and place them on a substrate
then wire bond the die to that substrate then encapsulate that substrate in a package to be mounted on a PCB. 

If your end customer is placing these parts directly on a printed circuit board, then they can not use “die” level product. See How They Make Wafers and Computer Chips here.

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