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Die Products (References) |
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Introduction To Die Products |
Unpackaged die allow designers to overcome the challenges of small form factor applications. |
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Known Good Die |
Known-Good-Die (KGD) processing allows for better yields and improved short-term reliability. |
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Known Good Die Myths |
Four myths about Known-Good-Die (KGD). |
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Die Case Studies |
Innovative uses of die products in four different applications. |
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>>Die Assembly Processes |
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System-In-Package Assembly |
Combining all of the electronic components. |
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>>Wafer Thinning |
References |
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>>Die Attach |
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>>Wire Bond |
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>>Assembly Process |
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>>Module Testing |
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Flip-Chip Assembly |
Offers optimized electrical performance in addition to optimized miniaturization. |
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>>Solder Flip Chip |
References |
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>>Underfill Encapsulation |
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>>Adhesive Flip Chip |
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>>Wafer Level Packaging |
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>>Process Flow |
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>>Process Considerations |
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Chip-On-Board (COB) Assembly |
Provides the capability to perform direct chip to chip wiring that facilitates improved performance and strong functional integration in many modern high speed applications. |
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>>Process |
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>>PCB Preparation |
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>>Die Attach |
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>>Encapsulation |
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>>More Encapsulation |
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Challenges In Bare Die Mounting |
Challenges In Bare Die Mounting
(Larry Gilg
Die Products Consortium Austin,Texas) |
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Quality & Reliability |
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Guidelines For Handling Die |
General Guidelines For Handling Die |
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Visual Inspection Criteria |
Visual criteria for the inspection of unpackaged die and wafers. |
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>>Contamination |
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>>Cracks |
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>>Bridging & Shorting |
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>>Glassification |
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>>Scratches |
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>>Delamination |
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Assembly Workmanship Criteria |
Criteria covering die placement, encapsulation, spacing, wirebond, and rebonding. |
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>>Encapsulation |
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>>Spacing |
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>>Wirebond |
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>>Rebonding |
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Chip On Board (COB) Reliability |
Life test, evaluation systems, process flow design issues. |
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General Guidelines |
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Storage, Handling, & Shipping of Die Products |
Safe handling guidelines for packaged ICs that are practiced in the Surface Mount Technology (SMT) assembly industry, and to provide information to purchasers of wafer and die products. |
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>>Handling |
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>>Shipping Materials |
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>>Shipping Technologies |
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>>Mounting and Dicing |
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Bare Die Product Standards |
An overview of Bare Die standards |
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>>Developing New Standards |
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>>Existing Statndards |
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Articles |
Useful articles relating to Bare Die technologies. |
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>>Burn-in Effectiveness -- Theory & Measurement |
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>>Defect level as a Function of Fault Coverage |
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>>Die Products: Ideal IC Packaging for Demanding Applications |
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