ES Components | A Franchised Distributor and Manufacturer
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application specific devices,Testing, Processing & storage

Discrete Component Specialist
Manufacturer and Franchised Distributor
ES Components

 

Application Specific Device Solutions, Testing, Processing and Storage


Application Specific Devices Solutions

Let us know what specification and device characteristics you need...

  • Custom designed semiconductors or passive components manufactured to your precise source control drawing (SCD)

  • Available for commercial, military, and space level applications

  • Benefits include short design cycle, miniaturized components, engineering R&D assistance, and fast production times

visual inspection

Active, Passive, Discrete, and IC Semiconductor Die as well as other Components.

  • inspection is performed by qualified inspectors, under microscopes in ESD protected Clean Rooms.

  • We inspect to appropriate Military Specifications or to your SCD (Source Controlled Drawing).

  • The norm is MIL-STD-883, method 2010 condition “A” or “B” or MIL-STD-750, methods 2072 and 2073.

  • We offer inspection at any Magnification up to 500X.

Testing, Processing and Storage

Protected Inventory

  • Bare die products stored in their waffle packs in a 7-mil ESD-sensitive, Dri-Shield™ 2700 vacuum sealed moisture barrier bag

  • Each bag contains a MIL-D-3464 approved clay desiccant for additional environmental protection

Lot acceptance testing

  • Customer specific SCD (Source Control Drawing)

  • Upscreening of components

  • MIL-PRF-38534 Classes H & K

  • MIL-PRF-19500 Element Evaluation, Classes H & K

  • DPA-destructive physical analysis

  • SEM-scanning electron microscopy

  • Samples packaged for radiation testing

Detailed lot traceability

  • We maintain manufacturer’s lot numbers and original manufacturer’s Certificate of Compliance

  • State-of-the-art distribution software system provides traceability and lot number availability within seconds

  • Certificate of Compliance hardcopy held on file for reference

  • AS6081 counterfeit avoidance (self-audited)

Wafer processing

  • “Saw, sort, load”

  • Sawn on film/frame

  • Die into specified waffle pack

  • Inspect to MIL-STD-883 or MIL-STD-750

  • Inspect to SCD (source control drawing)

  • Packaged in any required configuration within waffle pack

  • Expedited processing available

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