ES Components | A Franchised Distributor and Manufacturer

application specific devices,Testing, Processing & storage

Application Specific Device Solutions, Testing, Processing and Storage

Application Specific Devices Solutions

Let us know what specification and device characteristics you need...

  • Custom designed semiconductors or passive components manufactured to your precise source control drawing (SCD)

  • Available for commercial, military, and space level applications

  • Benefits include short design cycle, miniaturized components, engineering R&D assistance, and fast production times

visual inspection

Active, Passive, Discrete, and IC Semiconductor Die as well as other Components.

  • inspection is performed by qualified inspectors, under microscopes in ESD protected Clean Rooms.

  • We inspect to appropriate Military Specifications or to your SCD (Source Controlled Drawing).

  • The norm is MIL-STD-883, method 2010 condition “A” or “B” or MIL-STD-750, methods 2072 and 2073.

  • We offer inspection at any Magnification up to 500X.

Testing, Processing and Storage

Protected Inventory

  • Bare die products stored in their waffle packs in a 7-mil ESD-sensitive, Dri-Shield™ 2700 vacuum sealed moisture barrier bag

  • Each bag contains a MIL-D-3464 approved clay desiccant for additional environmental protection

Lot acceptance testing

  • Customer specific SCD (Source Control Drawing)

  • Upscreening of components

  • MIL-PRF-38534 Classes H & K

  • MIL-PRF-19500 Element Evaluation, Classes H & K

  • DPA-destructive physical analysis

  • SEM-scanning electron microscopy

  • Samples packaged for radiation testing

Detailed lot traceability

  • We maintain manufacturer’s lot numbers and original manufacturer’s Certificate of Compliance

  • State-of-the-art distribution software system provides traceability and lot number availability within seconds

  • Certificate of Compliance hardcopy held on file for reference

  • AS6081 counterfeit avoidance (self-audited)

Wafer processing

  • “Saw, sort, load”

  • Sawn on film/frame

  • Die into specified waffle pack

  • Inspect to MIL-STD-883 or MIL-STD-750

  • Inspect to SCD (source control drawing)

  • Packaged in any required configuration within waffle pack

  • Expedited processing available