Application Specific Device Solutions, Testing, Processing and Storage
Application Specific Devices Solutions
Let us know what specification and device characteristics you need...
Custom designed semiconductors or passive components manufactured to your precise source control drawing (SCD)
Available for commercial, military, and space level applications
Benefits include short design cycle, miniaturized components, engineering R&D assistance, and fast production times
Active, Passive, Discrete, and IC Semiconductor Die as well as other Components.
inspection is performed by qualified inspectors, under microscopes in ESD protected Clean Rooms.
We inspect to appropriate Military Specifications or to your SCD (Source Controlled Drawing).
The norm is MIL-STD-883, method 2010 condition “A” or “B” or MIL-STD-750, methods 2072 and 2073.
We offer inspection at any Magnification up to 500X.
Testing, Processing and Storage
Bare die products stored in their waffle packs in a 7-mil ESD-sensitive, Dri-Shield™ 2700 vacuum sealed moisture barrier bag
Each bag contains a MIL-D-3464 approved clay desiccant for additional environmental protection
Lot acceptance testing
Customer specific SCD (Source Control Drawing)
Upscreening of components
MIL-PRF-38534 Classes H & K
MIL-PRF-19500 Element Evaluation, Classes H & K
DPA-destructive physical analysis
SEM-scanning electron microscopy
Samples packaged for radiation testing
Detailed lot traceability
We maintain manufacturer’s lot numbers and original manufacturer’s Certificate of Compliance
State-of-the-art distribution software system provides traceability and lot number availability within seconds
Certificate of Compliance hardcopy held on file for reference
AS6081 counterfeit avoidance (self-audited)
“Saw, sort, load”
Sawn on film/frame
Die into specified waffle pack
Inspect to MIL-STD-883 or MIL-STD-750
Inspect to SCD (source control drawing)
Packaged in any required configuration within waffle pack
Expedited processing available