Consumer-electronics, automotive, and defense industries are moving more and more towards miniaturization as a means to provide more efficient products. What does this mean? Manufacturers must deliver products that do not increase cost significantly. The challenge – deliver more accurate equipment in a smaller package. Make it smaller, add more functionality, keep it cost-effective. These demands keep the device industry constantly moving forward, requiring the manufacturers to improve the capabilities of their devices to meet the requirements of the OEM’s. The trend today is moving more and more towards the use of bare die.
Years ago, Bare Die usage was driven by Military High Reliability applications where weight, size and reliability were important. Later, cars created a challenge for the designers for “under the hood” environments where the solutions required low cost components with military reliability. Designers of space constrained systems face the challenge of determining how to incorporate expanding functional need into smaller spaces in a timely and cost-effective manner. The requirements for smaller devices and higher memory are fueling the need for bare die memory solutions.
Think of what’s used today with all the many handheld devices, portable and small products, cell phones, etc. Even the washing machine, dryer and air conditioner all require small electronic components that operate in hostile environments. The products we demand are all becoming smaller and smaller but many are still subject to high heat, humidity, vibration or hostile environments. With smaller trace lengths between devices, bare die solutions enable higher frequency operation as processor and bus speeds increase. A classic example of this is the graphics card in your personal computer where both speed and integration are vital. Clearly, bare die form housed in customized packaging has become very popular.
Size, weight, reliability, performance and cost are drivers for bare die technology. With many module companies worldwide, the OEM’s are being increasingly exposed to bare die technology in one form or another. The military created the requirement that initially drove the demand. Now the consumer has taken over. With the growing need for miniaturization, improved performance and reliability, the possible applications for the use of bare die is endless. Bare Die is the way to go! Do you agree?