US scientists develop new process to make stacks of semiconductors just a few atoms thick
R&D departments at the University of Chicago and Cornell University have pieced together a new atomic scale semi-conductor manufacturing procedure that can provide “the foundation for modern integrated circuitry”.
Researchers at the University of Chicago (UChicago) and Cornell University claim they have developed a new method to make stacks of semiconductors that are just a few atoms thick.
According to a study published in the scientific magazine Nature, the new method may allow scientists and engineers to perform a simple, cost-effective procedure to make thinner semiconductor layers, which could come into use on devices ranging from solar cells to mobile telephones.
Reference: PV Magazine