ES Components offers a wide variety of Wire-Bondable Passive Components and Substrates/Interconnects from Vishay Electro-films. ES Components supports the most popular devices with an “Off The Self Inventory” (OTSI).
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Wire-Bondable Bare Die Capacitors
Vishay EFI capacitors are based on Silicon Oxide (MOS) and Silicon Oxide / Nitride (MNOS) combinations. The high-quality dielectric film deposited by our state-of-the-art equipment is the key factor for the high performance that characterizes these capacitors.
A wide range of values and sizes helps simplify the integration of these products into new and existing applications. A wide range of values and sizes helps simplify the integration of these products into new and existing applications.
- NC Series sizes range from 20 x 20 mils to 60 x 60 mils
- Tight value tolerances
- Low TCC (Temperature Coefficient of Capacitance): (+ 45 ± 25 ppm/°C MNOS, + 15 ± 25 ppm°/C MOS)
- Excellent life value stability
- Wide range of values (0.5 pF to 1000 pF)
Note: Additional values and form factors available upon request.
Vishay Wire-Bondable Passive Components Brochure