ES Components offers a wide variety of Wire-Bondable Passive Components and Substrates/Interconnects from Vishay Electro-films. ES Components supports the most popular devices with an “Off The Self Inventory” (OTSI).
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In addition to the standard products, custom designs are also offered with unique values, sizes, and configurations in a wide range of substrate materials and film compositions that provide maximum flexibility for high-end applications.
All members of this product family share Vishay EFI’s high standards for performance and quality.
Vishay High Frequency Wire-Bondable Spiral Inductors
Spiral inductors are designed for RF circuits that require wire-bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Additional values and form factors available upon request.
• RF choking for DC biasing
• RF tuning circuits
• Lumped element filters
• High frequency
• Wire bond assembly
• Low DCR, high Q
• Low parasitic capacitance, high SRF
• Equivalent circuit model enclosed
• S parameter files available for download
• Sample kit available
Note: Additional values and form factors available upon request.
Vishay Wire Bondable Passive Components Brochure