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ES Components offers a wide variety of Wire-Bondable Passive Components and Substrates/Interconnects from Vishay Electro-films.  ES Components supports the most popular devices with an “Off The Self Inventory” (OTSI).

Over 5 Million In-Stock!  Available Now (24 Hour Delivery)!  Low Minimum Order Quantities (MOQ)!

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In addition to the standard products, custom designs are also offeredwith unique values, sizes, and configurations in a wide range of substrate materials and film compositions that provide maximum flexibility for high-end applications.

 

All members of this product family share Vishay EFI’s high standards for performance and quality.  

 

Vishay High Frequency Wire-Bondable Spiral Inductors

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Spiral inductors are designed for RF circuits that require wire-bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Additional values and form factors available upon request.

 

Applications

• RF choking for DC biasing
• RF tuning circuits
• Lumped element filters

Features

• High frequency
• Wire bond assembly
• Low DCR, high Q
• Low parasitic capacitance, high SRF
• Equivalent circuit model enclosed
• S parameter files available for download
• Sample kit available

 
 

Note:  Additional values and form factors available upon request.

Vishay Wire Bondable Passive Components Brochure

 

Vishay Wire-Bondable Passive Components and Substrate/Interconnects Display Card

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