Wire-Bondable Passive Components and Substrates/Interconnects from
In addition to the standard products, custom designs are also offered with unique values, sizes, and configurations in a wide range of substrate materials and film compositions that provide maximum flexibility for high-end applications.
All members of this product family share Vishay EFI’s high standards for performance and quality.
Wire-Bondable Bare Die Resistors
Vishay EFI offers standard thin film wire-bondable resistors to fit a wide variety of hybrid circuit applications. Standard products are fabricated on an oxidized silicon substrate using tantalum nitride as the resistor element and with aluminum contact pads. However, these resistors may be customized for other applications by using different materials. The resistors are also available on quartz, alumina, and AlN substrates; the resistor film can be nickel chromium; gold contact pads are also available, and gold backing can be provided.
High-reliability military, space, and medical components
Hybrid applications where epoxy die attach and wire bonding are the assembly technique
Lumped element filters
Impedance tuning networks
Analog designs requiring high precision and/or high levels of customization
Applications requiring miniature form factors
Highlighted Products: View ES Components EFI Thin Film Resistors Off-The-Shelf
Bare Die Wire-bondable Resistors
Note: Additional values and form factors available upon request.
Vishay Wire-Bondable Passive Components Brochure