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Substratesand Interconnects

Substrates and Interconnects

Vishay is a leading-edge manufacturer of thin film custom substrates using alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), quartz, silicon, ferrites, titanates and a wide range of metallization alternatives such as nichrome, tantalum nitride, titanium tungsten, copper, nickel, gold and aluminum.

Vishay Electro-Films offers very robust solid metal filled vias.

Call ES Components today to discuss your requirements in detail to jointly develop the optimum metalization structure for your application.


  • Copper power lines up to 5000 microinches thick
  • Gold small signal lines ± 100 microinches width tolerance
  • Temperatures to 350 °C
  • Substrate material: Alumina, Beryllium Oxide or Aluminum Nitride
  • Excellent adhesion
  • Metallized through holes
  • Filled vias
  • Resistors available
  • Sizes up to 4 inches x 4 inches
Hybrid Cross Section


Vishay Electro-Films (EFI) has developed a thin film process that has the unique capability of incorporating up to 5000 microinches thick plated copper conductors on the same substrate with standard 100 to 300 microinches thick conductors. Some hybrid circuit applications require thick copper conductors for the power lines but standard thickness small signal lines to maintain tight line width control of critical elements. For example, a microwave application may require high power bias current to GaAs or other semiconductor devices while also requiring tight line width control to obtain good high frequency performance for lange couplers, filters or other critical signal patterns. For standard, high power, low frequency hybrid circuit substrates, thick copper plating alone is ideal. The 5000 microinches thick plated copper has a resistivity of less than 0.15 mΩ/square. In most cases, the dc or low frequency copper power lines are overplated with nickel and gold to prevent oxidation, permitting high temperature processing and operation. The conductor material for the small signal lines is normally gold. Several substrate materials and various adhesion metals are available.

Examples of Special Capabilities


Optical Submounts
  • Custom ceramic circuit board based on highly thermally conductive materials such as AlN and BeO
  • This copper patterning capabilities up to 0.006” thick (150 um)
  • Solid filled vias
  • Gold/Tin solder deposition and patterning facilitating low thermal resistance die attach


Side Wall Patterning II
Side Wall Patterning
  • SDWP – capability for custom substrates
  • Replaces wirebonds
  • Side patterned connections have lower inductance and therefore operate better at high frequency
  • SDWP allows die assembly on the side wall of the ceramic chip. This allows better integration with the optical elements of the design (fibers, prisms, lenses etc.)
  • Allows up to 4 sides to be patterned: top, bottom and two additional opposite side walls
  • Available with Al2O3 or AlN substrates
  • Plate thickness <= 0.025” (planned to 0.040”)
  • Line width and gap >= 0.003”
  • Line and gap tolerances as low as +/- 0.001”
  • Metal pattern to dice edge tolerance down to +/-0.002”


Transmission Line
  • RF simulations during design review
  • Reflection coefficients (S11)
  • Insertion loss (S21)
  • Multiple variations for experimentation and process optimization

Application Notes

An Introduction to PIMIC (Passive Integrated Microelectronic Interconnect Circuitry) Substrates

Application Specific Pattern Substrates

Applications and Design of Plated and Filled Vias

Applications of High Conductivity Traces

Cost Effective Substrates

Laser Diode Substrate Mounts

Substrate Pattern Characteristics & Capabilities

Thin Film High-Density Integration (HDI) Design Guidelines

Thin Film-High-Density Interconnects

Vishay Wire-Bondable Passive Components and Substrate/Interconnects Display Card

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