ES Components acquires Siliconix Military, JAN and Hermetic Business
Unless you have been doing this for a good number of years you will quickly find out that there is a lot more involved than just searching for a Part# on the Internet.
In microelectronics, a “three dimensional integrated circuit” (3D IC) is an integrated circuit manufactured by stacking silicon wafers ...
Stanford University recently determined that hafnium diselenide (HfSe2) and zirconium diselenide (ZrSe2) have properties that make them possible successors to silicon
Wafer dicing is the process by which die are separated from a wafer of semiconductorfollowing the processing of the wafer.
Handling Bare Die can be tricky...
Why Are Silicon Wafers Round, Instead Of Rectangular?
The size of your thumb are roughly the dimensions to which electronic medical devices are shrinking.
Specifying and obtaining the correct bare die to build hybrid microcircuits and multi-chip modules presents some specific problems.
Unpackaged Die In Embedded Designs Have Benefits.
Electrical Performance, Size & Weight, Integration, Reliability
What is Bare Die? Where is it used? What are the benefits of using Bare Die? These are questions that many design engineers and buyers ask.
See what they are!
Consumer-electronics, automotive, and defense industries are moving more and more towards miniaturization as a means to provide more efficient products.
See the Cost Savings!