Navigating Semiconductor Obsolescence:
Securing and Sustaining EOL/DMSMS Legacy Systems

ES Components is a proven supplier specializing in comprehensive solutions to address Diminishing Manufacturing Sources (DMS), Diminishing Manufacturing Sources and Material Shortages (DMSMS), End-of-Life (EOL) sustainment, and component obsolescence challenges in the Military, Aerospace, and Space industries. Home to the world’s largest Legacy Die & Wafer Bank, ES Components offers unmatched access to critical, discontinued microelectronic components. Leveraging decades of industry expertise, strategic sourcing capabilities, and strong relationships with original component manufacturers (OCMs), we ensure long-term availability through form-fit-function replacements, lifecycle management, and custom packaging or re-engineering solutions. Our proactive approach to counterfeit mitigation and legacy system support helps maintain mission-readiness, reduce program risk, and extend the life of essential platforms.

Manufacturers around the world rely on ES Components to provide them with off-the-shelf DMSMS and DMS obsolete electronic parts and hard-to-find components that cannot be found anywhere else. In fact, we maintain an extensive inventory of qualified Die & Wafer Bank, sourced from military and high-reliability programs. Most parts maintain full documentation, including the chain of custody and the original manufacturer’s Certificate of Compliance.

🔹World’s Largest Legacy Die & Wafer Inventory

🔹Obsolescence Solutions and Custom Packaging Programs

🔹LTB and EOL Long-Term Storage Die & Wafer Form

🔹Hi-Rel Manufacturing and Turnkey Custom Assemblies

  • MIL-PRF-19500

  • MIL-PRF-38534

  • MIL-PRF-38535

DMSMS Obsolescence Solutions

“ESC” Brand Products and Turn-Key Custom Assemblies

MIL-PRF-19500, 38534, 38535 equivalent

  • All hermetic packages, flows, and QCI

  • Obsolescence solutions

  • Siliconix Inside – Hermetic Siliconix products from ES Components

  • Custom hirel assemblies: monolithic or arrays in hermetic DIP or LCC; multi-chip power modules

  • Convert plastic diodes to hirel hermetic SMD device using same DIE

ES Components ESx8EU8H03 Hermetic
8A / 300V Hyperfast Diode

• Hermetic U8 (SMD.2) SMT package with
MIL-PRF-19500 equivalent screening

• Bare Die with element evaluation per
MIl-PRF-38534 (if required)

• Hermetic alternative to Vishay commercial
8ETH03-M3 device

• Engineering Model Units and Die available
from ES COMPONENTS Stock!

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