The Component Risk Checklist Most Programs Never Document

A practical, one-page checklist engineers and buyers can use to identify hidden component, lifecycle, and supply chain risks before they turn into delays, redesigns, or DMSMS emergencies.

Most component risk doesn’t come from bad parts —
it comes from assumptions that never get written down.

This free checklist helps engineering and procurement teams surface risks that often appear years after design freeze, when options are limited and costs are high.

Who This Is For

→Design & hardware engineers
→Buyers and supply chain professionals
→Program and sustainment teams

Used by engineering and procurement teams supporting long-life electronics programs.
If you’re responsible for keeping a design supportable beyond first production, this applies to you.
No sales follow-ups. No spam.This checklist is shared for professional use only.

Download The Free Checklist

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→ What Procurement Gets Blamed For. (But Rarely Controls)

→ Most Procurement Mistakes Don’t SHow Up Until After The PO Clears.

→ When “Close Enough” Resistance Isn’t Good Enough.

→ Component Selection Debt Doesn’t Announce Itself.

→ Engineering Support Doesn’t Stop At The Part Number.

→ The Lead Time You’re Quoting Isn’t The Lead Time You’re Getting.

→ Design Breakthroughs Don’t Come From Guesswork.

→ Things That No One Writes Down.

→ Hermetic. Not Hype. When a sealed package isn’t just nice-to-have — it’s mission-critical.

→ Did You Know That —- Precision Starts At The Substrate

→ Did You Know? Not all semiconductor suppliers support products the same way over time.

→ If Engineers Designed Grocery Stores…

→ Your BOM Has A Memory Problem

→ Attention Wolfspeed SiC Users: Plan Ahead

→ The Risks You Didn’t Model

→ Which Risks Were Pushed Downstream?

→ The Most Expensive Component Problem Is The One No One Documents

→ Vendor Managed Inventory Is Usually Framed As A Procurement Tool

→ Semiconductors DOn’t Fail Because They Are Out Of Spec

→ Easy-To-Buy Parts Are A Liability

→ Obsolescence Is A Problem For Later

→ The BOM Is Lying To You

→ Not All “Equivalent Parts” Are Actually Equivalent

→ The Part That Almost Killed The Program

→ Optimizing Bare Die Selection For Reliable Hybrid Circuits

→ Active & Passive Components —- What Is the Difference Between The Two?

→ Vendor-Managed Inventory Isn’t About Inventory

→ How To Choose The Right DIstributor. (Without Asking The Obvious Questions)

→ The BOM Decision That Outlives Your Program

→ The Hidden Cost Of “Good Enough”

→ Built For Longetivity. Powered By Partnership. ES Components x Knowles

→ Long Lead Times Aren’t A Market Anomaly. They’re A Warning.

→ The Failure Mode Nobody Looks For

→ When “Equivalent” Isn’t Equal

→ Built On Reliability —- ES Componenbts x Good-Ark Semiconductor

→ Innovation Doesn’t Happen Alone - - - And It Doesn’t Happen By Accident

→ Thick vs. Thin Film Resistors: Understanding The Differences

→ Key Challenges In Medical Integrtaed Circuits Today

→ Why Engineers Should Rely On Distributors For Component Sourcing

→ Are We Focusing On The Wrong Things When It Comes To Semiconductor Reliability?

→ The Engineering Debt You Can’t See

→ Strategies To Extend Product Life Cycles: Rethinking Obsolescence Management

→ Strength In Partnership: ES Components x Vishay Intertechnology

→ Is The Industry Too Dependent on COTS For Mission-Critical Systems?

→ Custom Assemblies: Where Innovation Actually Happens

→ How To Evaluate A Custom Assembly Partner: (From An Engineers Point Of View)

→ Why Hermeticity Still Matters In Aerospace Electronics

→ Strength Through Collaboration: ES Components x Microchip Technology

→ The Safer The Mission: The Future Of Hi-Rel

→ The Risk You Don’t See Until It’s Too Late

→ The Myth Of “Good Enough COTS”

→ Excellence Without Compromise: Where Quality Meets Mission Assurance