VISHAY EFI CHIP RESISTORS
Vishay EFI offers a variety of sizes and solutions for chip and wire assembly needs. Vishay single value wire bondable chip resistors are available on silicon, alumina, or quartz. Silicon substrates offer the highest power handling while quartz and alumina substrates have lower parasitic capacitance between the resistors and mounting board. Single value chip resistors are available with a back contact option, which reduces the number of wire bonds from two to one. Ranging in case sizes of 0201 to 1206, the resistor chips offer wire bondable terminations in Au or Al with options for backside
metallization for various attachment methods.
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VISHAY EFI CHIP CAPACITORS
Vishay EFI wire bondable Metal Oxide Silicon (MOS) / Metal Nitride Oxide Silicon (MNOS) capacitors offer a small size, thin film option. Vishay EFI manufactures top contact single value thin film chip capacitors with silicon dioxide and silicon nitride dielectric on a silicon substrate. The top termination is available as either sputtered aluminum or plated gold and the backside metal is sputtered gold for mounting with conductive epoxy or some solders. EFI also produces binary MOS multi-value capacitor chips which allow the user many choices in value selection. Custom capacitor networks are another option, either by customer drawing or through collaboration
with the Vishay EFI design team.
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VISHAY EFI SPIRAL INDUCTORS
Vishay EFI offers thin film wire bondable spiral inductors on quartz or alumina substrates. The spiral inductors are used in RF designs and circuits that require wire bondability. The Vishay EFI Chip Inductor has low DC Resistance (DCR), low parasitic capacitance, high quality factor or Q factor and high Self Resonant Frequency (SRF). Available in case sizes from 0303 to 0505, these parts are perfect for space
saving applications in the RF industry.
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VISHAY EFI MICROWAVE HIGH POWER
Vishay EFI high frequency products include chip resistors, resistor arrays and tapped resistors all on a alumina substrate and the spiral chip inductor on quartz. The chip resistors are available with wire bondable or solderable terminations which can also be used as a flip chip.  The microwave products provide excellent high-frequency response and are typically used in applications for Amplifiers, Oscillators, Attenuators and more. Please reference additional information in our High Frequency Brochure. The high power wire bondable resistor product families offer the highest power in a small footprint. These resistors are available with both back contact and top contact configurations. The power handling ratings range from 500mW up to 4 W of power. The high temperature wire bondable resistors are designed
to operate in environments up to 250 °C
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VISHAY EFI SUBSTRATES
Vishay EFI offers a variety of substrates for custom thin film solutions. The three substrates mainly used in our custom solutions are Alumina (Al2O3), Aluminum Nitride (AlN) and Beryllium Oxide (BeO) either lapped, as-fired or polished surface finishes. Alumina is a cost-effective solution that is commonly used for its surface quality and high frequency performance. For power applications and when high thermal conductivity is needed, AlN and BeO substrates are optimal. Important factors to consider when choosing a substrate include dielectric constant, surface finish, loss tangent, thermal conductivity, coefficient of thermal expansion and cost. Vishay EFI produces on substrates that range in thickness from 5 mils to 60 mils and range in size from 20 x 20 mils to 4.50 in x 4.50 in.
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